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Tapes - Thermal Release Tape

» Home > Thermal Release Tape

NDS, NDS 台灣日脈, NDS Immersion Cooling System, NDS Dicing Service Center Taiwan, Totally Dicing, Dicing Saw, Automatic Dicing Saw, NDS Dicing System, Dicing Tape, Dicing Blades, Grinding Wheel, Dicing Accessories, Auxiliary Machines, Dicing Fluids, Wafer Cleaner, Dressing Board, Chuck Table, Wafer Mounter, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package, Polishing Pad, Polishing Template, Wafer Ring, Wafer Coin Box, Green, cleaning, coating, heat dissipation, 清洗, 焊接, 冷卻, 散熱, 塗佈, Coolant, Cleaning, Cooling, Soldering, Coating, Chiller, 切磋琢磨, Dicing, Lapping, Polishing, Grinding, 台灣半導體展, 半導體展, 半導體, 切SiP金屬刀, 系統級封裝, 金屬刀, SiP, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package

Feature

The use of thermal release tape is heated to a certain temperature so that the film from the workpiece can be peeled off easily.

Suitable for process temporary fixing

Customize adhesive thickness

Single side and double side adhesive available



New customize item for one side thermal release adhesive layer and the other side is acrylic adhesive type(low adhesion strength).	It is double sided thermal release adhesive type.	It is single sided thermal release adhesive type.

Relative Products

Heat-Resistant Tape

Heat-Resistant Tape

NDS, NDS 台灣日脈, NDS Immersion Cooling System, NDS Dicing Service Center Taiwan, Totally Dicing, Dicing Saw, Automatic Dicing Saw, NDS Dicing System, Dicing Tape, Dicing Blades, Grinding Wheel, Dicing Accessories, Auxiliary Machines, Dicing Fluids, Wafer Cleaner, Dressing Board, Chuck Table, Wafer Mounter, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package, Polishing Pad, Polishing Template, Wafer Ring, Wafer Coin Box, Green, cleaning, coating, heat dissipation, 清洗, 焊接, 冷卻, 散熱, 塗佈, Coolant, Cleaning, Cooling, Soldering, Coating, Chiller, 切磋琢磨, Dicing, Lapping, Polishing, Grinding, 台灣半導體展, 半導體展, 半導體, 切SiP金屬刀, 系統級封裝, 金屬刀, SiP, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package

Dicing Tape

Dicing Tape

NDS, NDS 台灣日脈, NDS Immersion Cooling System, NDS Dicing Service Center Taiwan, Totally Dicing, Dicing Saw, Automatic Dicing Saw, NDS Dicing System, Dicing Tape, Dicing Blades, Grinding Wheel, Dicing Accessories, Auxiliary Machines, Dicing Fluids, Wafer Cleaner, Dressing Board, Chuck Table, Wafer Mounter, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package, Polishing Pad, Polishing Template, Wafer Ring, Wafer Coin Box, Green, cleaning, coating, heat dissipation, 清洗, 焊接, 冷卻, 散熱, 塗佈, Coolant, Cleaning, Cooling, Soldering, Coating, Chiller, 切磋琢磨, Dicing, Lapping, Polishing, Grinding, 台灣半導體展, 半導體展, 半導體, 切SiP金屬刀, 系統級封裝, 金屬刀, SiP, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package

Curing System

Curing System

NDS, NDS 台灣日脈, NDS Immersion Cooling System, NDS Dicing Service Center Taiwan, Totally Dicing, Dicing Saw, Automatic Dicing Saw, NDS Dicing System, Dicing Tape, Dicing Blades, Grinding Wheel, Dicing Accessories, Auxiliary Machines, Dicing Fluids, Wafer Cleaner, Dressing Board, Chuck Table, Wafer Mounter, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package, Polishing Pad, Polishing Template, Wafer Ring, Wafer Coin Box, Green, cleaning, coating, heat dissipation, 清洗, 焊接, 冷卻, 散熱, 塗佈, Coolant, Cleaning, Cooling, Soldering, Coating, Chiller, 切磋琢磨, Dicing, Lapping, Polishing, Grinding, 台灣半導體展, 半導體展, 半導體, 切SiP金屬刀, 系統級封裝, 金屬刀, SiP, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package

Wafer Mounter

Wafer Mounter

NDS, NDS 台灣日脈, NDS Immersion Cooling System, NDS Dicing Service Center Taiwan, Totally Dicing, Dicing Saw, Automatic Dicing Saw, NDS Dicing System, Dicing Tape, Dicing Blades, Grinding Wheel, Dicing Accessories, Auxiliary Machines, Dicing Fluids, Wafer Cleaner, Dressing Board, Chuck Table, Wafer Mounter, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package, Polishing Pad, Polishing Template, Wafer Ring, Wafer Coin Box, Green, cleaning, coating, heat dissipation, 清洗, 焊接, 冷卻, 散熱, 塗佈, Coolant, Cleaning, Cooling, Soldering, Coating, Chiller, 切磋琢磨, Dicing, Lapping, Polishing, Grinding, 台灣半導體展, 半導體展, 半導體, 切SiP金屬刀, 系統級封裝, 金屬刀, SiP, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package

NANO 321
NANO 150G

Dicing Blades

Resin Bond Blade
New Metal Bond Blade for dicing system-in-package (SiP)
Metal Bond Blade
Electroformed Bond Blade
Vitrified Bond Blade
Hub Blade

Tapes

Dicing Tape
Heat-Resistant Tape
Thermal Release Tape
Polyimide Tape

Grinding Wheel

Si Wafer
SiC Wafer
Sapphire Wafer

Dicing Accessories

Chuck Table
Dressing Board

Auxiliary Machines

CO₂ Bubbler
Wafer Mounter
Curing System
Wafer Cleaner

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