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Auxiliary Machines – CO₂ Bubbler

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Auxiliary Machines - Hermes CO2 Bubblers

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Hermes Ultrapure water antistatic system for ESD protection, developed by AVVA R&D Corp, can constantly control the ultrapure water resistivity within high precision range during dynamic flow. It can calibrate the resistivity instantly in high water flow rate situation. Easy maintenance. Zero consumables.

Purpose of CO₂ Bubbler: Preventing ESD during the dicing or grinding process. Preventing ESD when ultrapure water flows through the pipes.

Application

Wafer Dicing/ Wafer Grinding/ Laser Grooving /Scrubber/ Water Jet Cleaning/ Stripper cleaning

Water Jet Cleaning/ HPMJ

Monitoring Performance

co2

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Wafer Mounter

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Curing System

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NDS, NDS 台灣日脈, NDS Immersion Cooling System, NDS Dicing Service Center Taiwan, Totally Dicing, Dicing Saw, Automatic Dicing Saw, NDS Dicing System, Dicing Tape, Dicing Blades, Grinding Wheel, Dicing Accessories, Auxiliary Machines, Dicing Fluids, Wafer Cleaner, Dressing Board, Chuck Table, Wafer Mounter, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package, Polishing Pad, Polishing Template, Wafer Ring, Wafer Coin Box, Green, cleaning, coating, heat dissipation, 清洗, 焊接, 冷卻, 散熱, 塗佈, Coolant, Cleaning, Cooling, Soldering, Coating, Chiller, 切磋琢磨, Dicing, Lapping, Polishing, Grinding, 台灣半導體展, 半導體展, 半導體, 切SiP金屬刀, 系統級封裝, 金屬刀, SiP, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package

Dicing Tape

Dicing Tape

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Wafer Cleaner

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NANO 321
NANO 150G

Dicing Blades

Resin Bond Blade
New Metal Bond Blade for dicing system-in-package (SiP)
Metal Bond Blade
Electroformed Bond Blade
Vitrified Bond Blade
Hub Blade

Tapes

Dicing Tape
Heat-Resistant Tape
Thermal Release Tape
Polyimide Tape

Grinding Wheel

Si Wafer
SiC Wafer
Sapphire Wafer

Dicing Accessories

Chuck Table
Dressing Board

Auxiliary Machines

CO₂ Bubbler
Wafer Mounter
Curing System
Wafer Cleaner

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