Dicing Blades – Metal Bond Blade

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Metal bond blade, sintered and mold pressed under high temp. and pressure, has high rigidity and long blade life. With higher wear-resistance, balanced blade wearing profile, and higher stiffness, the metal bond blades can effectively reduce cutting defects such as slant cut and PKG size/profile issues while providing very long blade life.

Features: A wide selection of bonds available for various semiconductor packages such as BGAs as well as for glass and quartz cutting.; Ultra thin blade(over 45um)

Applications: Sapphire, BGAs(BGA, LGA, CSP, SiP, MCP, EMMC, uSD card), Glass for CIS Modules and Opticals, Quartz, MLCC，Ceramics

Specifications

SD600-25-MH 56D/0.15T/40H
Grit Type	Grit Size	Concentration	Bond	OD	Thickness	ID
SD	600	25	MH	56D	0.15T	40H

Concentration

Grit Type	Bond	Hardness	Concentration
SD CBN	MH	Soft V Hard	15 ~ 125
	MS
	M43
	M18

Tolerance

OD (mm)		Thickness (mm)		ID(mm)
Size	Tolerance	Size	Tolerance	Size	Tolerance
50.8~125	+0.1/- 0	0.10~0.35	±0.003~±0.020	40/55/75/88.9	H6

Grit Size / Standard Specification

Grit Size		Thickness (mm)
Grit Size		~0.10	0.10	0.11~0.14	0.15~0.19	0.20~0.29	0.30~0.34	0.35
#3000	02/06	*	•	•	•	•	•	•
#2000	04/08	*	•	•	•	•	•	•
#1500	05/10	*	•	•	•	•	•	•
#1200	06/12	*	•	•	•	•	•	•
#1000	08/16	*	•	•	•	•	•	•
#800	10/20	*		•	•	•	•	•
#700	12/25	*			•	•	•	•
#600	20/30	*			•	•	•	•
#500	30/40	*				•	•	•
#400	40/60	*				•	•	•
#325		*					•	•
#270		*						•
#230		*						•
#200		*						•

* For Motionnet system, commercially available Ethernet LAN cable that ensures high-quality communication at high speed is recommended.