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Automatic Dicing Saw – NANO 321

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Automatic Dicing Saw - NANO320

NDS, NDS 台灣日脈, NDS Immersion Cooling System, NDS Dicing Service Center Taiwan, Totally Dicing, Dicing Saw, Automatic Dicing Saw, NDS Dicing System, Dicing Tape, Dicing Blades, Grinding Wheel, Dicing Accessories, Auxiliary Machines, Dicing Fluids, Wafer Cleaner, Dressing Board, Chuck Table, Wafer Mounter, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package, Polishing Pad, Polishing Template, Wafer Ring, Wafer Coin Box, Green, cleaning, coating, heat dissipation, 清洗, 焊接, 冷卻, 散熱, 塗佈, Coolant, Cleaning, Cooling, Soldering, Coating, Chiller, 切磋琢磨, Dicing, Lapping, Polishing, Grinding, 台灣半導體展, 半導體展, 半導體, 切SiP金屬刀, 系統級封裝, 金屬刀, SiP, New Metal Bond Blade for dicing system-in-package (SiP), Metal Bond Blade, system-in-package

Function- In-line dressing during dicing: To eliminate operating time; To reduce the dicing cost; To increase productivity

Specifications

Item	Descriptions	Unit	NANO 321
Workpiece size			Max.φ12" Max. 320 mm square (*)
X-axis	Cutting rang	mm	320
X-axis	Max. cutting speed	mm/s	0.1~600
Y-axis	Cutting rang	mm	320
	Index step	mm	0.00005
	Positioning accuracy	mm	0.003 or less /320
Z-axis	Max. stroke	mm	32.2
	Moving resolution	mm	0.00005
	Repeatability accuracy	mm	0.001
	Max. blade size (*2)	mm	Φ60
θ-axis	Max. rotating angle	deg.	360
Spindle	Output	kW	1.8 at 60,000 minˉ¹
	Rated torque	N･m	0.35
	Revolution speed range	minˉ¹	6,000~60,000
Applicable tape frame			2-12-1
Utilities	Machine dimensions	mm	1290 x 1180 x 1800
Utilities	Machine weight	kg	Approx. 1,200

*1. A special jig is required.

Environmental conditions: Keep room temperature fluctuations within ±1 °C of the set value. (Set value should be between 20 - 25°C).; Keep cutting water 2 °C above room temperature (fluctuations within ±1 °C).; Keep spindle cooling water the same as room temperature between 20 - 25 °C (fluctuations within ±1°C).; Use clean, oil-free air at a dew point of -15 °C or less. (Use a residual oil: 0.1 ppm. Filtration rating: 0.01 µm/99.5 % or more).; The machines should be used in an environment, free from external vibration. Do not install machine near a ventilation opening, heat generation equipment or oil mist generating parts.; This machine uses water. In case of water leakage, please install the machine on the floor with sufficient waterproofing and drainage treatments.

NANO 321
NANO 150G

Dicing Blades

Resin Bond Blade
New Metal Bond Blade for dicing system-in-package (SiP)
Metal Bond Blade
Electroformed Bond Blade
Vitrified Bond Blade
Hub Blade

Tapes

Dicing Tape
Heat-Resistant Tape
Thermal Release Tape
Polyimide Tape

Grinding Wheel

Si Wafer
SiC Wafer
Sapphire Wafer

Dicing Accessories

Chuck Table
Dressing Board

Auxiliary Machines

CO₂ Bubbler
Wafer Mounter
Curing System
Wafer Cleaner

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