Dicing Blades – Resin Bond Blade

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Resin bond blade, with the characteristic of free-cutting and self-sharpening, can efficiently improve cut quality and efficiency on ductile and gummy materials such as QFNs and coppers and on hard and brittle materials such as glass and ceramics.

Features: Reduce copper burr and smear on ductile and gummy materials.; Improve chipping, feed rate, and blade life on hard and brittle materials.; Ultra thin blade(over 50um)

Applications: QFNs, Glass for CIS Modules and Opticals, Ceramics, Quartz for Optical Fiber Communication, Splitter, IR-Cut Filter

Specifications

SD600-25BA 56D/0.1T/40H
Grit Type	Grit Size	Concentration	Bond	OD	Thickness	ID
SD	600	25	BA	56D	0.1T	40H

Concentration

Grit Type	Bond	Concentration
SD SDC CBN	BA BB BQ BS	25 ~ 100

Tolerance

OD (mm)		Thickness (mm)		ID(mm)
Size	Tolerance	Size	Tolerance	Size	Tolerance
52~76.2	±0.02	0.05~0.60	±0.005~±0.020	40	H7

Grit Size / Standard Specification

Grit Size		Thickness (mm)
Grit Size		0.05~0.10	0.11~0.15	0.16~0.20	0.21~0.25	0.26~0.30	0.40~0.60
#3000	02/06	•	•	•	•	•	•
#2000	04/08	•	•	•	•	•	•
#1500	05/10	•	•	•	•	•	•
#1200	06/12	•	•	•	•	•	•
#1000	08/16	•	•	•	•	•	•
#800	10/20	•	•	•	•	•	•
#600	20/30	•	•	•	•	•	•
#500	30/40		•	•	•	•	•
#400	40/60		•	•	•	•	•
#325				•	•	•	•
#270					•	•	•
#230						•	•
#200							•
#170							•

* For Motionnet system, commercially available Ethernet LAN cable that ensures high-quality communication at high speed is recommended.